Overall optimization of high-speed semiconductor laser modules

查看全文 作　　者：LIU Yu CHEN ShuoFu WANG Xin YUAN HaiQing XIE Liang ZHU [1]NingHua

机构地区：[1]Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

出　　处：《Chinese Science Bulletin》索引2009年第54卷第20期,共7页

基　　金：Supported by the National Natural Science Foundation of China (Grant Nos. 60820106004, 60536010, 60606019, 60777029 and 60837001);National High Technology Research and Development Program of China (Grant No. 2009AA03Z409);Major International Cooperation Projects of China (Grant No. 2006dfa11880) 摘　　要：Based on the high frequency techniques such as frequency response measurement,equivalent circuit modeling and packaging parasitics compensation,a comprehensive optimization method for packaging high-speed semiconductor laser module is presented in this paper.The experiments show that the small-signal magnitude frequency response of the TO packaged laser module is superior to that of laser diode in frequencies,and the in-band flatness and the phase-frequency linearity are also improved significantly. 关键词：激光模块半导体整体优化频率响应测量等效电路模型综合优化方法激光二极管高频技术

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Overall optimization of high-speed semiconductor laser modules

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