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30篇 您的检索式：期刊名="tronics Reliability"

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	题名	作者	年代	出处	被引量
1	Prognostics implementa- tion of electronics under vibration loading显示文摘	GU J BARKER D PECHT M	2007	Microelec- tronics Reliability2007，47，12：	1
2	Lateral punch-through TVS devices for on- chip protection in low-voltage applications显示文摘	URRESTI J HIDALGO S FLORES D ROIG J CORTE' s I REBOLL J	2005	Microelec- tronics Reliability2005，45，6：	1
3	3D electro-thermal investigations for reliability of ultra low on state resistance power mosfet显示文摘	Sauveplane J B Tounsi P Scheid E	2008	Microelec- tronics Reliability2008，，48：	1
4	Reliability of compound semiconductor devices for space application 显示文摘	SAMMY K	1999	Microelec tronics and Reliability1999，39，：	1
5	High power LED package with vertical structure显示文摘	LIN Ming-te YING Shang-ping LIN Ming-yao	2012	Microelec- tronics Reliability2012，52，5：	1
6	Contact resistance and adhesion performance of ACF interconnections to aluminum metallization 显示文摘	Zhang J H Chan Y C Alam M O etal	2003	Microelec- tronics Reliability2003，43，8：	1
7	RF Characteristics of Proton Radiated Large-Area SiGe HBTs at Extreme Temperatures显示文摘	QIN Guoxuan YAN Yuexing JIANG Ningyue	2012	tronics Reliability2012，52，11：	1
8	Low cost soft error hardened lateh designs for nano-seale CMOS teeh-nology in presence of process variation 显示文摘	RAJAEI R TABANDEH M FAZELI M	2013	Microelec- tronics Reliability2013，53，6：	1
9	Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds显示文摘	Rooney D T Nager D P Gelgeretal	2005	Microelec tronics reliability2005，45，2：	1
10	Optimization of high voltage LDMOSFETs with complex multiple- resistivity drift region and field plate 显示文摘	CANG Y H LIN S W CHANG C H	2010	Microelec- tronics Reliability2010，50，：	1
11	Defect generation in InGaN/GaN light-emitting diodes under forward and reverse electrical stresses 显示文摘	Cao X A Sandvik P M LeBoeuf S F	2003	Microelec- tronics Reliability2003，43，：	1
12	Novel radiation hardened latch de- sign considering process, voltage and temperature varia- tions for nanoscale CMOS technology 显示文摘	NAN H CHOI K	2011	Microelec- tronics Reliability2011，51，12：	1
13	Life- time Assessment of Bisphenol-A Polycarbonate (BPA-PC) Plastic Lens, Used in LED-based Products显示文摘	M Yazdan M W D van Driel K M B Jansen	2014	Microelec- tronics Reliability2014，54，1：	1
14	Design and optimization of thermo - mechanical reliability in wafer level packaging 显示文摘	Fan X J Varia B Hart Q	2010	Microelec- tronics Reliability2010，50，4：	1
15	Reliability evaluation of logic circuits using probabilistic gate models 显示文摘	Jie Han Hao Chen Erin Boykin	2011	Microelec- tronics Reliability2011，51，2：	1
16	显示文摘	Ouedj C Imbert G Martinez E	2007	Microelec- tronics Reliability2007，47，：	1
17	A novel impact test sys- tem for more efficient reliability testing 显示文摘	Hokka J Mattila T T Li J	2010	Microelec- tronics Reliability2010，50，8：	1
18	Migration issues in sintered- silver die attaches operating at high temperature显示文摘	Riva R Buttay C Allard B	2013	Microelec- tronics Reliability2013，53，911：	1
19	A reparable multistate device with arbitrarily distributed repair times 显示文摘	Chung W K	1981	Microelec- tronics and Reliability1981，21，2：	1
20	Low-temperature low- pressure die attach with hybrid silver particle paste显示文摘	Suganuma K Sakamoto S Kagami N	2012	Microelec- tronics Reliability2012，52，2：	1

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