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23篇 您的检索式：作者名="Dukovic J"

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	题名	作者	年代	出处	被引量
1	Photo- deposition of Pt on colloidal CdS and CdSe/CdS semiconductor nanostructures显示文摘	Dukovic G Merkle M G Nelson J H	2008	Advanced Materials2008，20，22：	1
2	The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass Transfer Effects显示文摘	Mehdizadeh S Dukovic J Andricacos P C	1993	Journal of Electrochemical Societiy1993，40，2：	1
3	Leukocyte count as an independent predictor of recurrent ischemic events显示文摘	Grau A J Boddy A W Dukovic D A	2004	Stroke2004，35，：	1
4	Leukocyte count as an independent predictor of recurrent ischemic events显示文摘	GRAU A J BODDY A W DUKOVIC D A	2004	Stroke2004，35，5：	1
5	Damascene copper electroplating for chip interconnections显示文摘	ANDRICACOS P C UZOH C DUKOVIC J O	1998	Ibm Journal of Research&Development1998，42，5：	1
6	The influence of lithographic patterning on current distribution in electrodeposition: Experimental study and mass-transfer effects显示文摘	Mehdizadeh S Dukovic J Andricacos P C	1993	Journal of Electrochemistry Society1993，140，2：	1
7	Damascene copper electroplating for chip interconnections 显示文摘	ANDRICACOS P C UZOH C DUKOVIC J O	1998	IBM Journal of Research and Development1998，42，5：	1
8	Photodeposition of Pt on colloidal CdS and CdSe/CdS semiconductor nanostructures显示文摘	Dukovic G Merkle M G Nelson J H		0，，：	1
9	Copper On-Chip Interconnections:A Breakthrough in Electrodeposition to Make Better Chips 显示文摘	Andricacos P C Uzoh C Dukovic J O	1999	The Electrochemical Society Interface1999，，：	1
10	Leukocyte count as an independent predictor of recurrent ischemic events 显示文摘	Grau A J Boddy A W Dukovic D A	2004	Stroke2004，35，5：	1
11	Damascene copper electroplating for chip interconnections显示文摘	ANDRICACOS P C UZOH C DUKOVIC J 0	1998	IBM Journal of Research and Development1998，42，5：	1
12	Computation of current distribution in electrodeposition, a review显示文摘	Dukovic J O	1990	IBM Journal of Research and Development1990，34，5：	1
13	Leukocyte count as an independent predictor of recurrent ischemic events显示文摘	Grau A J Boddy A W Dukovic DA et al	2004	Stroke2004，35，5：	1
14	Optimization of elec- trodeposit uniformity by the use of auxiliary electrodes 显示文摘	Mehdizadeh S Dukovic J Andricacos P C	1990	Journal of the Electrochemical Society1990，，1：	1
15	Damascene copper electroplating for chip interconneetions 显示文摘	ANDRICACOS P C UZOH C DUKOVIC J O	1998	IBM Journal of Research and Development1998，42，5：	1
16	Damascene copper electroplating for chip interconnections显示文摘	Andricacos P Uzoh C Dukovic J	1998	IBMJ Res Dev1998，42，5：	1
17	Leukocyte count as an independent predictor of recurrent ischemic events显示文摘	Grau A J Boddy AW Dukovic DA	2004	Stroke2004，35，：	1
18	Damascene copper electroplating for chip interconnections显示文摘	ANDRICACOS P C UZOH C DUKOVIC J O	1998	IBM Journal of Research and Development1998，42，5：	1
19	Leukncyte count as anindependent predictor of recurrent ischemic events 显示文摘	GRAU A J BODDY A W DUKOVIC D A	2004	Stroke2004，35，5：	1
20	The influence of lithographic patterning on current distribution: a model for microfabrication by electrodeposition显示文摘	Mehdizadel S Dukovic J O Andricacos P C	1992	J Electrochem Soc1992，139，1：	1

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