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47篇 您的检索式:作者名="Dussart"
    题名 作者 年代 出处 被引量
1黄果茄植物提取物对不同寄生虫中间宿主贝类的生物效应测定显示文摘采用常规浸杀灭螺的方法 ,观察黄果茄植物提取物对不同贝类的生物效应。设 8组浓度 ,观察 2 4h、4 8h和 72h不同贝类的死亡率 ,并计算LC50 。结果表明 ,当SX浓度为 8 64 0mg L ,室温在 (2 5± 1 )℃、水温 (2 3± 1 )℃时 ,对湖北钉螺、光滑双脐螺、静水椎实螺浸杀 4 8h ,其死亡率均达 1 0 0 %。 4 8h的LC50 分别为 0 3 3 2、0 858、0 74 7mg L。研究结果显示 ,黄果茄植物提取物是一种灭螺效果好且很有苗头的植物灭螺剂。徐兴建 魏风华 刘建兵 戴裕海 杨先祥 李文新 殷荣华 赵利琴 盛桂莲 Georges Dussart Jackie Trigwell 2001动物学杂志2001,36,3:8
2A review of systematic, distribution and ecology of tropical freshwater zooplankton显示文摘Dussart B H Femando C H Shiel R J 1984Hydrobiologia1984,,113:1
3Outbreak of Acute Hemorrhagic Conjunctivitis in French Guiana and West Indies Caused by Coxsackievirus A24 Variant: Phylogenetic AnalysisRoveals Asian Import 显示文摘Philippe Dussart Gaelle Cartet Pierre Huguet 2005Journal of Medical Virology2005,75,:1
4Outbreak ofacute hemorrhagic conjunctivitis in French Guiana andWest Indies caused by coxsackievirus A24Variant:Phy-logenetic analysis reveals Asian import显示文摘Dussart P Cartet G Huguet P 2005J Med Virol2005,75,4:1
5Les différentes catégories de plancton显示文摘B. H. Dussart 1965Hydrobiologia (-)1965,,1:1
6Les différentes catégories de plancton显示文摘B. H. Dussart 1965Hydrobiologia (-)1965,,1:1
7Internet: the One Plus Eight Re - volution' 显示文摘Dussart C 2000European Management Journal2000,18,:1
8Photoconductive switch enhancements and lifetime studies for use in stacked Blumlein pulsers显示文摘Davanloo F Dussart R Koivusaari K J 2000IEEE Trans on Plasma Sci2000,28,:1
9A review of systematics, distribution and ecology of tropical freshwater zooplankton显示文摘B. H. Dussart C. H. Fernando T. Matsumura-Tundisi R. J. Shiel 1984Hydrobiologia1984,,1:1
10Evaluation of an enzyme im- munoassay for detection of dengue virus NS1 antigen in human ser- um显示文摘Dussart P Labeau B Lagathu G 2006Clin Vaccine Immuno12006,13,11:1
11Photoconductive switch enhancements and lifetime studies for use in stacked Blumlein pulsers显示文摘DAVANLOO F DUSSART R KOIVUSAARI K J 2000IEEE Trans Plasma Science2000,28,5:1
12In situ X-ray photoelectron spectroscopy analysis of SiOxFy passivation layer obtained in a SF6/O2 cryoetching process显示文摘Pereira J Pichon L E Dussart R 2009Appl Phys Lett2009,94,07:1
13APOBEC3G ubiquitination by Nedd4-1 favors its packaging into HIV-1 particles 显示文摘Dussart S Douaisi M Courcoul M 2005J Mol Biol2005,345,:1
14Clinical and virological study of dengue cases and the members of their households:the multinational DENFRAME Project显示文摘Dussart P Baril L Petit L 2012PLoS Negl Trop Dis2012,6,1:1
15Outbreak of acute hemorrhagic conjunctivitis in French Guiana and West Indies caused by coxsackievirus A24 variant: phylogenetic analysis reveals Asian import 显示文摘Dussart P Cartet G Huguet P 2005J Med Virol2005,75,4:1
16Areview of systematics,distribution and ecology of tropical freshwater zooplankton显示文摘Dussart B H Fernando C H Matsumura-Tundisi T 0,,1:1
17The tyrosine kinases Fyn and Hck favor the recruitment of tyrosine-phosphorylated APOBEC3G into vif-defective HIV-1 particles显示文摘Douaisi M Dussart S Courcoul M 2005Biochemical and Biophysical Research Communications2005,,329:1
18A risk model for severe anemia to select cancer patients for primary prophy- laxis with epoetin alpha: a prospective randomized con- trolled trial of the ELYPSE study group显示文摘Ray-Coquard I Dussart S Goillot C 2009Ann Oncol2009,20,6:1
19A review of systematics,distribution and ecology of tropical freshwater zooplankton显示文摘Dussart B H Fernando C H Matsumura-Tundisi T 1984Hydrobiologia1984,113,:1
20Low-k integration: Gas screening for cryogenic etching and plasma damage mitigation显示文摘The integration of porous organo-silicate low-k materials has met a lot of technical challenges.One of the main issues is plasma-induced damage,occurring for all plasma steps involved during interconnects processing.In the present paper,we focus on porous SiOCH low-k damage mitigation using cryogenic temperature so as to enable micro-capillary condensation.The aim is to protect the porous low-k from plasma-induced damage and keep the k-value of the material unchanged,in order to limit the RC delay of interconnexion levels while shrinking the microchip dimension.The cryogenic temperature is used to condense a gas inside the porous low-k material.Then,the etching process is performed at the temperature of condensation in order to keep the condensate trapped inside the material during the etching.In the first part of this work,the condensation properties of several gases are screened,leading to a down selection of five gases.Then,their stability into the porous structure is evaluated at different temperature.Four of them are used for plasma damage mitigation comparison.Damage mitigation is effective and shows negligible damage for one of the gases at-50℃.Romain Chanson Remi Dussart Thomas Tillocher P. Lefaucheux Christian Dussarrat Jean Francois de M arneffe 2019Frontiers of Chemical Science and Engineering2019,13,3:1
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