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| 1 | Chemometric evaluation of concentration profiles from compounds relevant in beer ageing显示文摘 | Varmuza K Steiner I Glinsner T | 2002 | European Food Research and Technology2002，215，3： | 1 |
| 2 | Impact of vacuum environment on the hot embossing process显示文摘 | Roos N Wissen M Glinsner T Scheer HC | 2003 | Proceedings of the Society of PhotoOptical Instrumentation Engineers (SPIE)2003，5037，21： | 1 |
| 3 | 显示文摘 | Kurt Varmuza Ingrid Steiner Thomas Glinsner Helmut Klein | 2002 | European Food Research and Technology2002，，3： | 1 |
| 4 | Fabrication of 3D-photonic crystals via UV-nanoimprint lithography 显示文摘 | Glinsner T Lindner P Muhlberger M | 2007 | Journal of Vacuum Science & Technology B2007，25，6： | 1 |
| 5 | Nanoimprint Lithography -A Next Generation High Volume Lithography Technique显示文摘Nanoimprint Lithography has been demon-strated to be one of the most promising next genera-tion techniques for large-area structure replicationin the nanometer scale. This fast and low costmethod becomes an increasingly important instru-ment for fabrication of biochemistry,m-fluidic, m-TAS and telecommunication devices, as well as for awide variety of fields in the nm range, like biomedical,nano-fluidics,nano-optical applications, datastorage, etc.Due to the restrictions on wavelength and theenormous development works, linked to high pro-cess and equipment costs on standard lithographysystems, nanoimprint lithography might become areal competitive method in mainstream IC industry.There are no physical limitations encountered withimprinting techniques for much smaller replicatedstructures, down to the sub-10nm range [1]. Amongseveral Nanoimprint lithography techniques resultsof two promising methods, hot embossing lithogra-phy (HEL) and UV-nanoimprinting (UV-NIL) will bepresented. Both techniques allow rapid prototypingas well as high volume production of fully patternedsubstrates for a wide range of materials.This paper will present results on HE and UV-NIL, among them full wafer imprints up to 200mmwith high-resolution patterns down to nm range. | R. Pelzer P. Lindner T. Glinsner B.Vratzov C.Gourgon S.Landis P. Kettner C. Schaefer | 2004 | 半导体技术2004，29，7： | 0 |
| 6 | 用于聚合物基微流体MEMS的等离子体活性晶圆键合技术(英文)显示文摘Lab-on-chip或μ-TAS(micro—total arialysis systems)结合流体处理、检测及数据分析,是一种便携式的低成本高效器件。在微流体应用中,聚合物具有比硅或玻璃器件更明显的优势,它包括:宽泛的材料选择性,成本低、效率高,使用任意性,生物兼容性,抗化学品和工艺灵活性。为了实现采用这类材料制备小型集成化系统,我们发展了新的制备与封装技术。这项工作着眼于运用等离子体活化低温直接键合技术实现纳/微结构聚合物在低温条件下进行封装。由纳米压印光刻制作的纳/微结构的聚合物器件,可能是异质(聚合物与玻璃或硅)或同质(聚合物与聚合物)键合。为了改进键合材料的物理和化学熔合,键合工序通常在接近聚合物的玻璃化转变温度的高温下进行。但遗憾的是,高温损伤了微细图形,特别是对于高深宽比结构。在EVG 810LT等离子体反应室里,我们采用软射频频率等离子体表面处理,来进行聚合物的等离子体活化,它能在不改变聚合物体特性的前提下清洗和活化聚合物顶层。最终结果是,在EVG 501晶圆键合机上,两个活化的表面在低温下通过施加一个适中的、均匀的接触压力而连接在一起,保证了空腔密封并防止了小结构的破坏和变形。键合工艺条件为:真空条件为从大气到200~1000Pa、接触压力为2~5kN、温度从室温到80℃。 | Dr. Sharon Farrens Paul Kettner Thomas Glinsner | 2006 | 电子工业专用设备2006，35，1： | 0 |
| 7 | The Evolution of Wafer Bonding Moving from the back-end further to the front-end显示文摘1 IntroductionAs the nanoscale era progresses, innovative new materials and processes continue to be developed and implemented as a means of keeping the industry | Thomas Glinsner Peter Hangweier | 2009 | 电子工业专用设备2009，38，3： | 0 |
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