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	题名	作者	年代	出处	被引量
1	Lanthanum-substituted bismuth titanate for use in non-volatile memories 显示文摘	PARK B H KANG B S NOH T W	1999	Nature1999，401，：	2
2	Molec- ular aspects of leaf senescence显示文摘	QUIRINO B F NOH Y S HIMELBLAU E AMASINO R M	2000	Trends in Plant Science2000，5，7：	1
3	Characterization of fatty acidcomposition in vegetable oils by Gas Chromatography andGhemometrics 显示文摘	Lee D S Noh B S Bae S Y	1998	Anal Chim Acta1998，358，：	1
4	Mechanical reliability of Sn-Ag BGA solder joints with various electrolyses Ni-P and Ni-B plating layers显示文摘	Yoon J W Noh B I Jung S B	2010	Components and Packaging Technologies2010，33，1：	1
5	Solid-vapor equilibrium phase diagram of hydrogen-adsorbed carbon显示文摘	LEE K H NOH S J LEE B S	2000	Langmuir2000，16，10：	1
6	Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate显示文摘	YOON J W NOH B I JUNG S B	2014	Metals &Materials International2014，20，3：	1
7	Multiple heme oxygenase family members contribute to the biosynthesis of the phytochrome chromophore in Arabidopsis显示文摘	EMBORG T J WALKER J M NOH B	2006	Plant Physiol2006，140，3：	1
8	Effects of interface charges on imprint of epitaxial Bi4Ti3O12 thin films显示文摘	Noh T W Lee J	1997	Appl Phys Lett1997，70，9：	1
9	Molecular aspects of leaf senescence: Trends显示文摘	Quirino B F Noh Y S Himelblau E	2000	Plant Science2000，5，：	1
10	Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu 显示文摘	YOON J W NOH B I CHOI J H		J Mater Sci Mater Electron0，22，7：	1
11	Wettability and interra- cial reactions of Sn Ag-Cu/Cu and Sn-AgNi/Cu solder joints显示文摘	YOON J W NOH B I KIM B K	2009	Journal of Alloys and Compounds2009，486，12：	1
12	Preparation of dendritic copper nanostructures and their characterization for electroreduction显示文摘	Qiu R Cha H G Noh H B	2009	J Phys Chem C2009，113，15：	1
13	Hydrogen induced lattice migration in Pd-Pt alloy显示文摘	Flanagan T B Clewley J D Noh H	1998	Acta Mater1998，46，：	1
14	Effect of Ag addition on the corrosion properties of Sn-based alloys 显示文摘	BUI Q V NAM N D NOH B I KAR A KIM J C4 JUNG S B	2010	Materials and Corrosion2010，61，1：	1
15	Muhidrug resistance- like genes of Arabidopsis required for auxin transport and auxin-mediated development显示文摘	Noh B Murphy A S Spalding E P	2001	Plant Cell2001，13，：	1
16	Direct Electrochemistry of Laccase Immobilized on Au Nanoparticles Encapsulated- Dendrimer Bonded Conducting Polymer:Application for a Catechin Sensor显示文摘	Rahman M A Noh H B Shim Y B	2008	Anal Chem2008，80，：	1
17	Accounting for Emissions in the Measurement of Transit Agency Efficiency: A Directional Distance Function Approach显示文摘	McMullen B S Noh D W	2007	Transportation Research Part D2007，，12：	1
18	Remote plasma-assisted metal organic chemical vapor deposition of tantalum nitride thin films with different radicals显示文摘	Cho K N Han C H Noh K B	1998	J Appl Phys1998，37，12：	1
19	A new ferroelectric material for use in FRAM: lanthanum-substituted bismuth titanate显示文摘	NOH T W PARK B H KANG B S	2001	IEEE International Symposium on Applications of Ferroelectrics2001，1，：	1
20	Wettability and inter- facial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints 显示文摘	Yoon I W Noh B I Kim B K	2009	Journal of alloys and compounds2009，486，1：	1

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