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| 1 | 转速对6061-T6铝合金搅拌摩擦搭接焊接头力学性能的影响(英文)显示文摘采用场发射扫描电子显微镜(FE-SEM),研究转速对厚度为5 mm的6061-T6铝合金搅拌摩擦搭接焊接头的宏观和微观组织、硬度、搭接头剪切性能和失效模式的影响。结果表明:在最低的转速度下,上模板和下模板具有十分相似的硬度分布。采用EDX分析发现,焊核区的断裂面中含有Fe的化合物。 | Firouz FADAEIFARD Khamirul Amin MATORI Meysam TOOZANDEHJANI Abdul Razak DAUD Mohd Khairol Anuar Mohd ARIFFIN Norinsan Kamil OTHMAN Farhad GHARAVI Abdul Hadi RAMZANI Farhad OSTOVAN | 2014 | Transactions of Nonferrous Metals Society of China2014，24，4： | 5 |
| 2 | Temperature and water vapour effects on the cyclic oxidation behaviour of Fe–Cr alloys显示文摘 | Norinsan K. Othman Jianqiang Zhang David J. Young | 2010 | Corrosion Science2010，，9： | 2 |
| 3 | AA6061-T6合金搅拌摩擦焊搭接接头的腐蚀性能评价(英文)显示文摘采用氯化钠+过氧化氢溶液浸泡试验研究AA6061-T6铝合金搅拌摩擦焊搭接接头的腐蚀行为。采用循环动电位极化测试、扫描电子显微镜和能谱仪表征腐蚀形貌,揭示焊接区与基体合金的腐蚀机理。研究了焊接接头的显微组织和剪切强度。结果表明,与基体合金相比,焊接区在腐蚀溶液中会发生晶间腐蚀和点蚀。搭接剪切测试结果表明,所得焊接接头的拉伸剪切强度为128 MPa,超过基体合金强度的60%。电化学测试结果表明,焊核区和热影响区的保护电位比点蚀电位更负,说明焊核区与热影响区点蚀的趋势不强。基体合金抗腐蚀性比焊缝区的强,而热影响区的抗腐蚀性最差。点蚀主要源于金属间化合物边缘,因为与铝基体相比,金属间化合物的自腐蚀电位更高而成为阴极。由于焊缝区的金属间化合物增加,腐蚀电偶增加,焊缝的抗腐蚀性降低。 | Farhad GHARAVI Khamirul A.MATORI Robiah YUNUS Norinsan K.OTHMAN Firouz FADAEIFARD | 2016 | Transactions of Nonferrous Metals Society of China2016，26，3： | 2 |
| 4 | Temperature and water vapour effects on the cyelic oxidation behaviour of Fe-Cr alloys显示文摘 | Norinsan K Othman Zhang Jianqiang David J Young | 2010 | Corrosion Science2010，52，： | 1 |
| 5 | Temperature and Water Vapour Effects on the Cyclic Oxidation Behavior of Fe-Cr Alloys显示文摘 | Othman Norinsan K Zhang Jian-qiang Young David J | 2010 | Corrosion Science2010，52，9： | 1 |
| 6 | A review on radiation-induced nucleation and growth of colloidal metallic nanoparticles显示文摘 | Alam Abedini Abdul Razak Daud Muhammad Azmi Abdul Hamid Norinsan Kamil Othman Elias Saion | 2013 | Nanoscale Research Letters2013，，1： | 1 |
| 7 | The Effect of Electrochemical Migration of Pb-free Sn-3.0Ag-0.5Cu Solder Reinforced by NiO Nanoparticles显示文摘As electronic devices continue to become lighter and thinner,they require much smaller solder joints and fine-pitch interconnections for microelectronic packaging.Pb-free solders incorporated with nano-sized particles have been identified as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders.The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu(SAC305)solder alloy.In this study,three different solder alloys were prepared by reflow soldering.Sn-3.0Ag-0.5Cu(SAC 305)solder alloys were doped with different percentage of NiO(nickel oxide)nanoparticles content;i.e.0.01 wt%,0.05 wt%,and 0.15 wt%in producing nanocomposite solder paste.Morphology refinement of SAC305-NiO nanocomposite solder contributed to the enhancement of mechanical properties in the field of microelectronic industries.ECM(electrochemical migration)of SAC-NiO nanocomposites solder pastes was measured using a WDT(water drop test).Effects of electrochemical migration of its surface morphology were investigated using OM(optical microscopy). | Fakhrul Rifdi Omar Emee Marina Salleh Norinsan Kamil Othman Fakhrozi Che Ani Zambri Samsudin | 2018 | 材料科学与工程(中英文A版)2018，8，5： | 0 |
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