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| 1 | Densification of Mo Alloys at 1473 K by Adding Ni-Cu Solid Solution显示文摘Mo is difficult to sinter densely at a relatively low temperature due to its high melting point. In the present paper, by adding different weight contents of Ni and Cu additives, Mo alloys have been densified at 1473 K for an hour by hot-pressing method, and the optimum contents of Cu and Ni additives have been acquired: when the contents of Ni and Cu are 3 and 2 wt pct respectively, the relative density of the sample reaches the maximum value. It was found that when the Ni-Cu solid solution was added into Mo alloys, the achieved density is higher than the case of Ni and Cu additives. The experimental results indicate that, Ni and Cu play different roles in the process of sintering, the Ni-Cu solid solution has the same function as Ni and Cu additives in the course of sintering Mo alloys, It shows more activating sintering feature for Mo than the Ni and Cu additives. | DaorenGONG ZhongminYANG QiangSHEN LianmengZHANC | 2004 | Journal of Materials Science & Technology2004，20，3： | 1 |
| 2 | Fractal dimension and fractal growth of urbanized areas显示文摘 | GU0 Qiangshen | 2002 | International Journal of Geographical Information Science2002，，： | 1 |
| 3 | Wave impedance of W-Mo system composite显示文摘W-Mo composites with different mass fractions of W and Mo were prepared at 1473 K by Spark Plasma Sintering technique. The transverse and longitudinal wave velocities of the samples were accurately measured using the ultrasonic pulse echo overlap method, and the wave impedance values of the samples were then calculated. The results show that W-Mo system composites are of nearly full dense and can be regarded as a mechanical mixture system. The ideal mixture model was adopted to estimate the wave impedance of W-Mo composites. Comparisons with the experimental data demonstrate that the suggested model is sufficiently accurate to predict the wave impedance of W-Mo composites. | QiangShen LianmengZhang HuaTan FuqianJing | 2003 | Journal of University of Science and Technology Beijing2003，10，5： | 1 |
| 4 | Pressureless Sintering of α‐Si<sub>3</sub>N<sub>4</sub> Porous Ceramics Using a H<sub>3</sub>PO<sub>4</sub> Pore‐Forming Agent显示文摘 | FeiChen QiangShen FaqiangYan LianmengZhang | 2007 | Journal of the American Ceramic Society2007，，8： | 1 |
| 5 | Fractal dimension and fractal growth of urbanized areas 显示文摘 | Guo Qiangshen | 2002 | International Journal of Geographical Information Science(S1365-8816)2002，16，5： | 1 |
| 6 | Type I methionine aminopeptidase from Saccharomyces cerevisiae is a potential target for antifungal drug screening显示文摘AIM: To screen antifungal drug candidates using in vitro and in vivo assays based on type I methionine aminopep- tidase from Saccharomyces cerevisiae (ScMetAP1). METHODS: A colorimetric assay suitable for high throughput screening (HTS) using recombinant ScMetAP1 protein expressed in Escherichia coli was established for antifungal lead discovery. A series of pyridine-2-carboxylic acid derivatives were characterized and a chemical library of 12 800 pure organic compounds was screened with the in vitro ScMetAP1 assay. Active compounds from the in vitro assay were further evaluated by a growth inhibition assay on yeast strain with deletion of ScMetAP1 gene map1 in comparison with the wild-type yeast strain and the yeast strain with deletion of type II enzyme (ScMetAP2) gene map2. RESULTS: Active ScMetAP1 inhibitors were identified from HTS. Some of the pyridine-2-carboxylic acid derivatives (compound 2 and 3) had selective inhibition of the growth of map2 deletion yeast and weak inhibition on wild-type yeast growth, while no inhibition on map1 deletion yeast. CONCLUSION: ScMetAP1 is a novel potential target for developing antifungal drugs. The in vitro and in vivo ScMetAP1 assays can serve as tools in discovering antifungal drug candidates. | Ling-lingCHEN JiaLI Jing-yaLI Qun-liLUO Wei-fengMAO QiangSHEN Fa-junNAN Qi-zhuangYE | 2004 | Acta Pharmacologica Sinica2004，25，7： | 1 |
| 7 | Effect of Cu Addition on W-Ni-Fe Alloys Sintered at a Low Temperature显示文摘In this study, Cu was added as the third additive to lower the sintering temperature of W-Ni-Fe alloy. By adding 2 wt pct Cu, a dense 93W-3.5Ni-l.5Fe-2.0Cu tungsten alloy was obtained by hot-pressing at a low temperature of 1573 K which is a process of liquid-phase sintering. As a result, the morphology of W-Ni-Fe alloy changed obviously after the addition of Cu and the alloy had-higher relative density and rupture strength. The mechanism of the densification of W-Ni-Fe-Cu alloy at the low temperature.was then mainly investigated. It was found that, part sintering activators Ni and Fe could exist in liquid form at 1573 K due to the addition of Cu, which made it easy for Ni and Fe to dissolve W and thus the full densification of W-Ni-Fe-Cu alloy at the low temperature was realized. | ChuanbinWANG QiangSHEN 等 | 2002 | Journal of Materials Science & Technology2002，18，3： | 0 |
| 8 | Synthesis and Sintering of ZrNiSn-based Half-Heusler Compounds显示文摘In contrary to the commonly used arc melting method, samples in the present paper were prepared by the solid statereaction from elemental powders at 1173 K under a flowing Ar atmosphere for 96~168 h. The constituent phases andthe elemental compositions were determined and shown that the samples were of single phase and stoichiometry. Thenthe spark plasma sintering technique was used to consolidate them. It is found that, dense ZrNiSn-based compoundswith fine grain size and homogeneous microstructure were achieved under the condition of 1123 K/40 MPa/25 min. | QiangSHEN LianmengZHANG LidongCHEN TakashiGOTO ToshioHIRAI | 2003 | Journal of Materials Science & Technology2003，19，5： | 0 |
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