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10篇 您的检索式：作者名="Shnawah"

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		题名	作者	年代	出处	被引量
	1	Recent advances on Mg2Si~-xSnx materials for thermo-electric generation显示文摘	BASHIR M B A SAID S M SABRI M F M SHNAWAH D A ELSHEIKH M H	2014	Renewable and SustainableEnergy Reviews2014，37，：	1
	2	A Re- view on Thermoelectric Renewable Energy: Principle Parame ters That Affect Their Performance显示文摘	Hamid Elsheikh M Shnawah D A Sabri M F M	2014	Renewable and Sus- tainable Energy Reviews2014，30，：	1
	3	A review onthermal cycling and drop impact reliability of SAC solder joint inportable electronic products显示文摘	SHNAWAH D A SABRI M F M BADRUDDIN I A	2012	Microelectronics Reliability2012，52，1：	1
	4	A Reviewon Thermoelectric Renewable Energy: Principle Parameters that Affect their Performance显示文摘	Elsheikh M H Shnawah D A Sabri M F M	2014	Renewable and Sustainable Energy Reviews2014，30，：	1
	5	A review on Thermoelectric Renewable Energy:Principle Parameters that Affect Their Performances显示文摘	Elsheikh M H Shnawah D A Sabri M F M	2014	Renew Sustain Energy Rev2014，30，：	1
	6	High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications 显示文摘	Shnawah D A Said S B M Sabri M F M	2012	Journal of Electronic Materials2012，41，9：	1
	7	A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products显示文摘	Shnawah D A Sabri M F M Badruddin I A		0，，01：	1
	8	A Re- view on Thermal Cycling and Drop Impact Reliability of SAC Solder Joint in Portable Electronic Products显示文摘	SHNAWAH D A SABRI M F M BADRUDDIN I A	2012	Micro- electronics Reliability2012，52，1：	1
	9	A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints显示文摘	ABDUL D SHNAWAH A	2012	Microelectronics International2012，，29：	1
	10	A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products显示文摘	Shnawah D A Sabri M F M Badruddin I A	2012	Microelectronics Reliability2012，52，1：	1

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