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13篇 您的检索式：作者名="Snugovsky"

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		题名	作者	年代	出处	被引量
	1	Electroless Ni/immersion Au interconnects:Investigation of black pad in wire bonds and solder joints 显示文摘	P Snugovsky P Arrowsmith M Romanskyl	2001	Journal of electronic materials2001，30，9：	1
	2	Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints显示文摘	P. Snugovsky P. Arrowsmith M. Romansky	2001	Journal of Electronic Materials2001，，9：	1
	3	Silicon segregation in aluminium casting alloys 显示文摘	Major J F Perovic D D	2000	Materials Science and Technology2000，16，：	1
	4	Electroless Ni/immersion Au interconnects: Investigation of black pad in wire bonds and solder joints 显示文摘	Snugovsky P Arrowsmith P Romansky M	2001	Journal of Electronic Materials2001，30，9：	1
	5	Experiments on the aging of Sn-Ag-Cu solder alloys 显示文摘	Snugovsky L Perovic D D Rutter J W	2004	Materials Seience and Technology2004，20，8：	1
	6	Experiments on interaction of liquid tin with solid copper 显示文摘	Snugovsky L Ruggiero M A Perovic D D	2003	Materials Science and Technology2003，19，7：	1
	7	Electroless Ni/immersion Au interconnects: Investigation of black pad in wire bonds and solder joints 显示文摘	Snugovsky P Arrowsmith P Romansky M	2001	Journal of Electronic Materials2001，30，9：	1
	8	Reliability investigation of mixed BGA assemblies显示文摘	Adam R Zbrzezny Polina Snugovsky Tanya Lindsay	2006	IEEE Transactions on Electronics Packaging Manufacturing2006，29，3：	1
	9	Experiments on interaction of liquid tin with solid copper显示文摘	SNUGOVSKY L RUGGIERO M A PEROVIC D D RUTTER J W	2003	Materials Science and Technology2003，19，7：	1
	10	A Study of Copper Dissolution During Pb-Free PTH Rework Using a Thermally Massive Test Vehicle显示文摘	Craig Hamilton Matthew Kelly Polina Snugovsky	2007	Circuits Assembly2007，5，：	1
	11	Impact of board and component metallizations on microstructure and reliability of lead-free solder joints显示文摘	Zbrzezny A R Snugovsky A P Perovic D D	2007	Microelectronics Reliability2007，，12：	1
	12	Effect of cooling rate on microstructure of Ag-Cu-Sn solder alloys 显示文摘	Snugovsky L Snugovsky P Perovic D D	2005	Material Sci- ence and Technology2005，21，1：	1
	13	Reactions in Sn Comer of Cu-Sn-Zn Alloy System显示文摘	PEROVIC D D SNUGOVSKY L SNUGOVSKY P	2012	Materials Science and Technology2012，28，1：	1

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