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35篇 您的检索式：作者名="Vianco"

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	题名	作者	年代	出处	被引量
1	Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper显示文摘	Vianco P T Xilgo A C Grant R	1995	Journal of Electronic Materials1995，24，10：	1
2	Influence of Temperature and Humidity on the Wettability of Immersion Tin Coated Printed Wiring Boards显示文摘	Ray U Artaki I Vianco P T	1995	IEEE T Compon Pack T (Part A)1995，18，1：	1
3	Dynamic recrystallization (DRX) as the mechanism for Sn whisker development显示文摘	VIANCO P T REJENT J A	2009	J Electron Mater2009，38，9：	1
4	An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance显示文摘	Vianco P T	1999	Circuit World1999，25，1：	1
5	Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys显示文摘	D. R. Frear P. T. Vianco	1994	Metallurgical and Materials Transactions A1994，，7：	1
6	Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-Pb coatings显示文摘	VIANCO P T HLAVA P F KILGO A C	1994	Electronic Materials1994，23，7：	1
7	Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings显示文摘	Paul T. Vianco Paul F. Hlava Alice C. Kilgo	1994	Journal of Electronic Materials1994，，7：	1
8	Properties of ternary Sn-Ag-Bi solder alloys:thermal properties and micro structural analysis显示文摘	Vianco P T Rejent J A	1999	Journal of Electronic Materials1999，28，10：	1
9	Ultrasonic soldering for structural and electronic applications显示文摘	VIANCO P T HOSKING F M REJENT J A	1996	Welding Journal1996，75，11：	1
10	Influence of Temperature and Humidity on the Wettability of Immersion Tin Coated Printed Wiring Boards 显示文摘	Ray U Artaki I Vianco P T	1995	IEEE T Compon Pack T Part A1995，18，1：	1
11	A barrier layer approach to limit Ti scavenging in FeNiCo/Ag-Cu-Ti/Al2O3 active braze joints 显示文摘	Vianco P T Stephens J J Hlava P F	2003	Welding Research2003，82，9：	1
12	Titanium scavenging in Ag - Cu - Ti active braze joints 显示文摘	Vianco P T Stephens J J Hlava P F	2003	Welding Research2003，82，10：	1
13	Issues in the replacement of leadbearing solders显示文摘	VIANCO P T FREAR D R	1993	Jom the Journal of the Minerals Metals &Materials Society1993，45，7：	1
14	Modeling the solid-state reaction between Sn-Pb solder and a porous substrate coating显示文摘	HOPKINS P VIANCO P	1998	J Electr Mater1998，27，11：	1
15	Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper显示文摘	KILGO A GRANT R	1995	J Electr Mater1995，24，10：	1
16	Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue显示文摘	Vianco P T Burchett S N Neilsen M K	1999	Journal of Electronic Materials1999，28，11：	1
17	Solid state intermetallic compound layer growth between copper and hot dipped indium coatings显示文摘	VIANCO P T KILGO A C GRANT R	1995	Journal of Materials Science1995，30，19：	1
18	Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper显示文摘	VIANCO P T KILGO A C GRANT R	1995	Journal of Electronic Materials1995，24，10：	1
19	Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper显示文摘	Vianco P T C Kilgo A Grant R	1995	Journal of Electronic Materials1995，24，10：	1
20	Evaluation of lead-free solder joints in electronic assemblies显示文摘	JCKSON A M VIANCO P T	1994	Journal of Electronic Materials1994，23，8：	1

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