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| 1 | Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm显示文摘Solder bumps are widely used in surface mount components, which provide electrical and mechanical connection between the chip/package and the substrate. As the solder bump getting smaller in dimension and pitch, it becomes more difficult to inspect the solder defects hidden in the IC package. In this paper, an intelligent inspection method using the scanning acoustic microscopy(SAM) and the fuzzy C-means(FCM) algorithm was investigated. A flip chip package of FA10 was chosen as the test sample. The SAM tests of FA10 were carried out in C-scan mode. The sub-image of every solder bump was segmented from the SAM image. The statistical features were then calculated and adopted for clustering of solder bumps using the FCM algorithm. The recognition results of FCM reached a high accuracy of 94.3%. The intelligent system is effective for defect inspection in high density packages. | LU XiangNing LIU Fan HE ZhenZhi LI LiYi HU NingNing SU Lei | 2018 | Science China(Technological Sciences)2018，61，9： | 4 |
| 2 | Effects of microstructure characteristics on the tensile properties and fracture toughness of TA15 alloy fabricated by hot isostatic pressing显示文摘Powder hot isostatic pressing(HIP) is an effective method to achieve near-net-shape manufacturing of high-quality complex thinwalled titanium alloy parts, and it has received extensive attention in recent years. However, there are few reports about the microstructure characteristics on the strengthening and toughening mechanisms of powder hot isostatic pressed(HIPed) titanium alloys. Therefore, TA15powder was prepared into alloy by HIP approach, which was used to explore the microstructure characteristics at different HIP temperatures and the corresponding tensile properties and fracture toughness. Results show that the fabricated alloy has a “basket-like structure” when the HIP temperature is below 950℃, consisting of lath clusters and surrounding small equiaxed grains belts. When the HIP temperature is higher than 950℃, the microstructure gradually transforms into the Widmanstatten structure, accompanied by a significant increase in grain size. The tensile strength and elongation are reduced from 948 MPa and 17.3% for the 910℃ specimen to 861 MPa and 10% for the 970℃ specimen.The corresponding tensile fracture mode changes from transcrystalline plastic fracture to mixed fracture including intercrystalline cleavage.The fracture toughness of the specimens increases from 82.64 MPa·m^(1/2)for the 910℃ specimen to 140.18 MPa·m^(1/2)for the 970℃ specimen.Specimens below 950℃ tend to form holes due to the prior particle boundaries(PPBs), which is not conducive to toughening. Specimens above 950℃ have high fracture toughness due to the crack deflection, crack branching, and shear plastic deformation of the Widmanstatten structure. This study provides a valid reference for the development of powder HIPed titanium alloy. | Langping Zhu Yu Pan Yanjun Liu Zhiyu Sun Xiangning Wang Hai Nan Muhammad-Arif Mughal Dong Lu Xin Lu | 2023 | International Journal of Minerals,Metallurgy and Materials2023，30，4： | 1 |
| 3 | Thermal conduction analysis and characterization of solder bumps in flip chip package显示文摘 | LU Xiangning SHI Tielin XIA Qi | 2012 | Applied Thermal Engineering2012，36，： | 1 |
| 4 | Analysis of the spatial and temporal expression pattern directed by the Populus tomentosa 4-coumarate:CoA ligase Pto4CL2 promoter in transgenic tobacco显示文摘 | Xiang Pan Huanhuan Li Hongyi Wei Wankai Su Xiangning Jiang Hai Lu | 2013 | Molecular Biology Reports2013，，3： | 1 |
| 5 | Intelligent diagnosis of the solder bumps defects using fuzzy C-means algorithm with the weighted coefficients显示文摘Solder bump technology has been widely used in electronic packaging. With the development of solder bumps towards higher density and finer pitch, it is more difficult to inspect the defects of solder bumps as they are hidden in the package. A nondestructive method using the transient active thermography has been proposed to inspect the defects of a solder bump, and we aim at developing an intelligent diagnosis system to eliminate the influence of emissivity unevenness and non-uniform heating on defects recognition in active infrared testing. An improved fuzzy c-means(FCM) algorithm based on the entropy weights is investigated in this paper. The captured thermograms are preprocessed to enhance the thermal contrast between the defective and good bumps. Hot spots corresponding to 16 solder bumps are segmented from the thermal images. The statistical features are calculated and selected appropriately to characterize the status of solder bumps in FCM clustering. The missing bump is identified in the FCM result, which is also validated by the principle component analysis. The intelligent diagnosis system using FCM algorithm with the entropy weights is effective for defects recognition in electronic packages. | LU XiangNing SHI TieLin WANG SuYa LI Li Yi SU Lei LIAO GuangLan | 2015 | Science China(Technological Sciences)2015，58，10： | 1 |
| 6 | Analysis on annealing-induced stress of blind-via TSV using FEM显示文摘 | Jie SHAO Tielin SHI Li DU Lei SU Xiangning LU Guanglan LIAO | 2018 | Frontiers of Mechanical Engineering2018，13，3： | 1 |
| 7 | Modulation of dynamic aggregation in fluorogenic SNAP-tag probes for long-term super-resolution imaging显示文摘The combination of super-resolution microscopy and synthetic fluorescence probes has emerged as a universal tool to monitor dynamic biological events at the nanometer scale.However,the limited site-specificity and fluorogenicity of synthetic fluorescent probes make it still difficult to realize long-term super-resolution imaging.Herein,we introduce a dynamic aggregation mediated SNAP-tag fluorogenic probe,BGAN-Aze,which can specifically bind to various SNAP-tag fusion proteins with 41-fold fluorescence enhancement.The equilibrium between the non-fluorescent aggregate/dimer(A–D)and the fluorescent monomer(M)of BGAN-Aze acts as an effective method to reduce the fluorescence background and endow BGAN-Aze with the capability of conducting washing-free super-resolution imaging of various intracellular and extracellular proteins.Using this probe,we monitored multiple dynamic biological events,such as MMC,mitophagy,the fusion of nucleolus,and the growth and contact of filopodia.We expect that BGAN-Aze will become a widely used SNAP-tag for super-resolution imaging of dynamic biological events and the A-D-M equilibrium can be a general strategy for designing fluorogenic probes. | Qinglong Qiao Wenjuan Liu Weijie Chi Jie Chen Wei Zhou Ning Xu Jin Li Xiangning Fang Yi Tao Yinchan Zhang Yingzhu Chen Lu Miao Xiaogang Liu Zhaochao Xu | 2023 | Aggregate2023，4，2： | 0 |
| 8 | Clustering compression-based computation-efficient calibration method for digital twin modeling of HVAC system显示文摘Digital twin is regarded as the next-generation technology for the effective operation of heating,ventilation and air conditioning(HVAC)systems.It is essential to calibrate the digital twin models to match them closely with real physical systems.Conventional real-time calibration methods cannot satisfy such requirements since the computation loads are beyond acceptable tolerances.To address this challenge,this study proposes a clustering compression-based method to enhance the computation efficiency of digital twin model calibration for HVAC systems.This method utilizes clustering algorithms to remove redundant data for achieving data compression.Moreover,a hierarchical multi-stage heuristic model calibration strategy is developed to accelerate the calibration of similar component models.Its basic idea is that once a component model is calibrated by heuristic methods,its optimal solution is utilized to narrow the ranges of parameter probability distributions of similar components.By doing so,the calibration process can be guided,so that fewer iterations would be used.The performance of the proposed method is evaluated using the operational data from an HVAC system in an industrial building.Results show that the proposed clustering compression-based method can reduce computation loads by 97%,compared to the conventional calibration method.And the proposed hierarchical heuristic model calibration strategy is capable of accelerating the calibration process after clustering and saves 14.6%of the time costs. | Jie Lu Xiangning Tian Chenxin Feng Chaobo Zhang Yang Zhao Yiwen Zhang Zihao Wang | 2023 | Building Simulation2023，16，6： | 0 |
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