维普期刊资源整合服务平台（V6.5）

维普中文期刊产品整合服务

10篇 您的检索式：作者名="Zambri"

选中清除导出查看参考文献查看引证文献引用追踪共1页首页上一页第1页下一页末页 /1 跳转

		题名	作者	年代	出处	被引量
	1	Analysis of lightning-caused ferroresonance in capacitor voltage transformer(CVT)显示文摘	Bakar A H A Rahim N A Zambri M K M	2011	International Journal of Electrical Power & Energy Systems2011，33，9：	1
	2	Drop test simulation and power spectrum analysis of a head actuator assembly in a hard disk drive显示文摘	Bao-Jun Shi Dong-Wei Shu Shao Wang Jun Luo Hui Meng Quock Ng Joseph H.T. Lau Razman Zambri	2006	International Journal of Impact Engineering2006，，1：	1
	3	Study of the shock response of the HDD with ANSYS-LSDYNA显示文摘	J. Luo D.W. Shu B.J. Shi Q.Y. Ng R. Zambri J.HT. Lau	2006	Journal of Magnetism and Magnetic Materials2006，，2：	1
	4	Shock analysis of a head actuator assembly subjected to half-sine acceleration pulses显示文摘	Dong-Wei Shu Bao-Jun Shi Hui Meng Fook Fah Yap Da-Zhi Jiang Quock Ng Razman Zambri Joseph H.T. Lau Chao-Shan Cheng	2005	International Journal of Impact Engineering2005，，2：	1
	5	Aerogels as hydrogenation catalysts显示文摘	Armor J N Carlson E J Zambri P M	1985	Applied Cataiysia1985，19，2：	1
	6	Aerogels as hydrogenation catalysts 显示文摘	ARMOR J N CARLSON E J ZAMBRI P M	1985	Applied Catalysis1985，19，：	1
	7	显示文摘	Zambri P M Leming R	1981	J Catal1981，72，1：	1
	8	Aerogels as hydrogenation catalysts显示文摘	J N Armor E J Carlson and P M Zambri	1985	Appl Catal1985，19，：	1
	9	The Effect of Electrochemical Migration of Pb-free Sn-3.0Ag-0.5Cu Solder Reinforced by NiO Nanoparticles显示文摘As electronic devices continue to become lighter and thinner,they require much smaller solder joints and fine-pitch interconnections for microelectronic packaging.Pb-free solders incorporated with nano-sized particles have been identified as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders.The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu(SAC305)solder alloy.In this study,three different solder alloys were prepared by reflow soldering.Sn-3.0Ag-0.5Cu(SAC 305)solder alloys were doped with different percentage of NiO(nickel oxide)nanoparticles content;i.e.0.01 wt%,0.05 wt%,and 0.15 wt%in producing nanocomposite solder paste.Morphology refinement of SAC305-NiO nanocomposite solder contributed to the enhancement of mechanical properties in the field of microelectronic industries.ECM(electrochemical migration)of SAC-NiO nanocomposites solder pastes was measured using a WDT(water drop test).Effects of electrochemical migration of its surface morphology were investigated using OM(optical microscopy).	Fakhrul Rifdi Omar Emee Marina Salleh Norinsan Kamil Othman Fakhrozi Che Ani Zambri Samsudin	2018	材料科学与工程(中英文A版)2018，8，5：	0
	10	Aero-Thermal Performances of Leakage Flows Injection from the Endwall Slot in Linear Cascade of High-Pressure Turbine显示文摘The existence of a gap between combustor and turbine endwall in the real gas turbine induces to the leakages phenomenon. However, the leakages could be used as a coolant to protect the endwall surfaces from the hot gas since it could not be completely prevented. Thus, present study investigated the potential of leakage flows as a function of film cooling. In present study, the flow field at the downstream of high-pressure turbine blade has been investigated by 5-holes pitot tube. This is to reveal the aerodynamic performances under the influenced of leakage flows while the temperature measurement was conducted by thermochromic liquid crystal(TLC). Experimental has significantly captured theaerodynamics effect of leakage flows near the blade downstream. Furthermore, TLC measurement illustrated that the film cooling effectiveness contours were strongly influenced by the secondary flows behavior on the endwall region. Aero-thermal results were validated by the numerical simulation adopted by commercial software, ANSYS CFX 13. Both experimental and numerical simulation indicated almost similar trendinaero and also thermal behavior as the amount of leakage flows increases.	Wan Aizon W Ghopa Zambri Harun Ken-ichi Funazaki Takemitsu Miura	2015	Journal of Thermal Science2015，24，1：	0

返回顶部每页显示：

共1页首页上一页第1页下一页末页 /1 跳转

goolge学术搜索-维普

网站首页 | 关于我们 | 联系我们 | 产品服务 | 客服中心 | 广告服务 | 版权声明 | 网站联盟 | 友情链接 | 售卡网点

版权所有© 渝B2-20050021-1　渝公网安备 50019002500403号　违法和不良信息举报中心

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费