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75篇 您的检索式:期刊名="SMT"
    题名 作者 年代 出处 被引量
1扩展率测试方法的研究[J]显示文摘罗道军 蔡颖颖 环球SMT与封装0,,:2
2无铅线路板组件枝晶生长风险[M]显示文摘罗道军 贺光辉 环球SMT与封装0,,:2
3Roadmap to BGA standads显示文摘 2000SMT2000,10,:1
4The ‘Black Pad’ Failure Mechanism-From Beginning to End显示文摘Ronad A Bulwith Michael Troshy Lous M Piccione 2002Global SMT & Packaging Journal2002,9,:1
5The 'Black-Pad' Failure Mechanism-from Beginning to End显示文摘Bulwith R A Trosky M Picchione L M 2002Global SMT & Packaging2002,2,16:1
6How to specify reliable PCBs for lead-free solder assembly显示文摘Werner Engelmaier 2006Global SMT & Packaging2006,9,:1
7Trends in medical device design and manufacturing显示文摘SALDITr P 2004Journal of SMT2004,17,3:1
8The 'Black Pad' Failure Mechanism From Beginning to End显示文摘Bulwith R A Troshy M Piccione I M 2002Global SMT & Packaging Journal2002,,9:1
9引线键合原理与工艺[J]显示文摘吴懿平 环球SMT与封装0,,:1
10Working with Large,Thick PCBs显示文摘Jennifer Nguyen Robert Thalhammer 2008SMT Surface Mount Technology Magazine2008,22,4:1
11Applying scanning laser technology to BGA inspection显示文摘 1995SMT Surface Mount Technology Magazine1995,9,10:1
12Lead-free : VOC-free flux deposition reduces defects显示文摘Tim L Soderstrom S and Ian W 2006SMT2006,20,2:1
13Evaluation of The Effects of Processing Conditions on Shear Strength and Microstructure in Pb- Free Surface Mount Assembly显示文摘Bukhari S Santos D L Lehaman L P 2004Journal of SMT2004,17,2:1
14Micro dispensing comes of age显示文摘WEDEKIN S 2001Smt Surf Mount Technol Mag2001,15,4:1
15Machine-vision and inspection test report 显示文摘Arena J Lipson P 2003SMT China2003,,5:1
16Placement Accuracy Management显示文摘Rick Flayler 2005SMT2005,8,:1
17The benefits of a ramp - to - spike reflow porfile显示文摘David Suraski 2000SMT2000,144,:1
18球栅阵列焊点表征与火效分析技术显示文摘AdamWMortensen LeeMaria RogerMDevaney 2015环球SMT与封装2015,15,3:1
19The ‘Black Pad' Failure mechanism--from beginning to end显示文摘Bulwith Ronald A Trosky Michael Picchione Louis M 2002Global SMT & Packaging2002,2,16:1
20Placement Accuracy Management 显示文摘Rick Flayler 2005SMT2005,,:1
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