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3篇 您的检索式:作者名="Fu Zengli"
    题名 作者 年代 出处 被引量
1Graphene transistors fabricated via transfer-printing in device active-areas on hrge wafer显示文摘Liang Xiangan Fu Zengli Chon S Y 2007Nano Lett2007,7,:1
2Synthesis and characterization of a new class of polymeric ligand exchangers for selective removal of arsenate from drinking water显示文摘Byungryul An Zengli Fu Zhong Xiong Dongye Zhao Arup K. SenGupta 2010Reactive and Functional Polymers2010,,8:1
3BRIDGING TOUGHENING OF EPOXY RESINS BY DISPERSED THERMOPLASTICS显示文摘The particulate toughening behaviour of epoxy resins modified by ductile thermoplasticsis elucidated here by various bridging models. The experimental data for three different epoxy/PSF sys-tems are presented to illustrate the trend of the toughening characteristics. The conventional continuousbridging model is shown to have underestimated the effect of the particulate toughening. A joint appli-cation of the discrete bridging model and the multiple bridging model, however, shows promising resultfor modified epoxy systems such as AG80/DDS/PSF and E51/DDS/PSF. These models also providequantitative descriptions for the crack pinning phenomenon previously observed by Fu and Sun inAG80/DDS/PSF.Yang Wei Fu Zengli Sun Yishi Tsinghua University, Beging 100084, China 1989Acta Mechanica Sinica1989,5,4:0
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