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39篇 您的检索式：作者名="LUM I"

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	题名	作者	年代	出处	被引量
1	Effect of Electronic Flame off parameters on copper bonding wire:Free-air ball deformability,heat affected zone length,heat affected zone breaking force显示文摘	Hang C J Song W H Lum I	2009	Microelectronic Engineering2009，8，10：	1
2	Effects of electrode degradation on electrode life in resistance spot welding of aluminum alloy 5182 显示文摘	Fukumoto S Lum I	2003	Welding Journal2003，9，11：	1
3	Nutritional quality of edible parts of Moringa oleifera显示文摘	SáNCHEZ-MACHADO D I Nú?EZ-GASTéLUM J A REYES-MORENO C	2010	Food Analytical Methods2010，3，3：	1
4	Pathogenicity island of virulent bacteria:strcture,function and impactonmicrobial evolu-tion显示文摘	Hacker J B lum OG Muhldoder I	1997	MolMirobiol1997，23，6：	1
5	Bonding mechanism in ultrasonic gold ball bonds on copper substrate显示文摘	Lum I Zhou Y	2005	Metall Mater trans2005，，36：	1
6	Her pes simplex virus-1 entry into cells mediated by a novel mem ber of the TNF/NGF receptor family显示文摘	MONTGOMERY R I WARNER M S LUM B J	1996	Cell1996，87，3：	1
7	Herpes simplex virus-l entry into cells mediated by a novel member of the TNF/NGF receptor family显示文摘	Montgomery R I Warner M S Lum B J	1996	Cell1996，87，：	1
8	Insufficient production and tissue delivery of CD4+ memory T cells in rapidly progressive simian immunodeficiency virus infection显示文摘	Picker L J Hagen S I Lum R		0，，：	1
9	Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate 显示文摘	LUM I MAYER M ZHOU Y	2006	Journal of Electronic Materials2006，35，3：	1
10	Enterovirus 71 infection and neurologic complications显示文摘	I Wong K T Lum L C Lam S K	2000	N Engl J Med2000，342，13：	1
11	Bonding mechanism in ultrasonic gold ball bonds on copper substrate 显示文摘	Lum I Jung J P Zhou Y	2005	Metallurgical and Materials Transactions A2005，36，：	1
12	Footprint study of uhrasonic wedgebonding with aluminum wire on copper substrate 显示文摘	Lum I Mayer M Zhou Y	2006	Journal of Electronic Materials2006，35，3：	1
13	Effects of electrode degradation on electrode life in resistance spot welding of aluminum alloy 5182显示文摘	Fukumoto S Lum I	2003	Welding Journal2003，9，11：	1
14	Sikic Rapid determination of PEGylated liposomal doxorubicin and its major metabolite in human plasma by ultravioletvisible high-performance liquid chromatography显示文摘	Chin DL Lum BL Branimir I	2002	J Chromatogr B2002，779，：	1
15	Electrode Pitting in Resistance Spot Welding of aluminum alloy 5182显示文摘	Lum I Fukumoto S Biro E		0，，：	1
16	Herpes simplex virus-1 entry into cells mediated by a novel member of the TNF/NGF receptor family显示文摘	Montgomery R I Warner M S Lum B J	1996	Cell1996，87，：	1
17	Bonding mechanism in ultrasonic gold ball bonds on copper substrate 显示文摘	LUM I JUNG J P ZHOU Y	2005	Metallurgical and Materials Transactions A2005，36，5：	1
18	Effects of electrode degradation on electrode life in resistance spot welding of aluminum alloy 5182显示文摘	Fukumoto S Lum I Biro E	2003	Welding Journal2003，82，11：	1
19	Electrode pitting in resistance spot welding of aluminum alloy 5182显示文摘	Lum I Fukumoto S Biro E	2004	Metallurgical and Materials Transactions A-Physical Metallurgy and Materials Science2004，35，1：	1
20	Finite element analysis of effect of electrode pitting in resistance spot welding of aluminum alloy显示文摘	Chang B H Zhou Y Lum I	2005	Science and Technology of Welding and Joining2005，10，1：	1

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