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| 1 | NONLINEAR BUCKLING BEHAVIOR OF DAMAGED COMPOSITE SANDWICH PLATES CONSIDERING THE EFFECT OF TEMPERATURE-DEPENDENT THERMAL AND MECHANICAL PROPERTIES显示文摘On the basis of the first-order shear deformation plate theory and the zig-zag deformation assumption, an incremental finite element formulation for nonlinear buckling analysis of the composite sandwich plate is deduced and the temperature-dependent thermal and mechanical properties of composite is considered. A finite element method for thermal or thermo-mechanical coupling nonlinear buckling analysis of the composite sandwich plate with an interfacial crack damage between face and core is also developed. Numerical results and discussions concerning some typical examples show that the effects of the variation of the thermal and mechanical properties with temperature, extermal compressive loading, size of the damage zone and piy angle of the faces on the thermal buckling behavior are significant. | Bai Ruixiang Chen Haoran (State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China) | 2001 | Acta Mechanica Solida Sinica2001，14，2： | 2 |
| 2 | Postbuckling behavior of face/core debonded composite sandwich plate considering matrix crack and contact effect显示文摘 | Chen Haoran Bai Ruixiang | 2002 | Composite Structures2002，57，14： | 1 |
| 3 | Study on failure process of delaminated stiffened composite plates under compression 显示文摘 | Chen Haoran Bai Ruixiang Wang Man | 2003 | Acta Mechanica Sinica (English Version)2003，19，4： | 1 |
| 4 | Study on failure process of delaminated stiffened composite plates under compression显示文摘 | Chen Haoran Bai Ruixiang Wang Man | 2003 | Acta Mechanica Sinica ( English Version )2003，19，4： | 1 |
| 5 | Study on failure process of delaminated stiffened composite plates under compression 显示文摘 | CHEN Hao-ran BAI Ruixiang WANG Man | 2003 | Acta Mech Sinica2003，19，4： | 1 |
| 6 | ZmGA3ox2 , a candidate gene for a major QTL , qPH3.1 , for plant height in maize显示文摘 | Feng Teng Lihong Zhai Ruixiang Liu Wei Bai Liqiu Wang Dongao Huo Yongsheng Tao Yonglian Zheng Zuxin Zhang | 2012 | Plant J2012，，3： | 1 |
| 7 | Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packaging显示文摘Vertically aligned carbon nanotubes arrays(VACNTs)are a promising candidate for the thermal interface material(TIM)of next-generation electronic devices due to their attractive thermal and mechanical properties.However,the environment required for synthesizing VACNTs is harsh and severely incompatible with standard device packaging processes.VACNTs’extremely low in-plane thermal conductivity also limits its performance for cooling hot spots.Here,using a transfer-and-encapsulate strategy,a two-step soldering method is developed to cap both ends of the VACNTs with copper microfoils,forming a standalone Cu-VACNTs-Cu sandwich TIM and avoiding the need to directly grow VACNTs on chip die.This new TIM is fully compatible with standard packaging,with excellent flexibility and high thermal conductivities in both in-plane and through-plane directions.The mechanical compliance behavior and mechanism,which are critical for TIM applications,are investigated in depth using in situ nanoindentation.The thermal performance is further verified in an actual light emitting diode(LED)cooling experiment,demonstrating low thermal resistance,good reliability,and achieving a 17℃ temperature reduction compared with state-of-the-art commercial TIMs.This study provides a viable solution to VACNTs’longstanding problem in device integration and free-end contact resistance,bringing it much closer to application and solving the critical thermal bottleneck in next-generation electronics. | Ruixiang Bai Yangbing Wei Jiyuan Xu Xiaobo Li Menglin Li Ziwen Zou Xinyan Huang Chengyu Liu Yiwei Sun Menglong Hao | 2023 | Nano Research2023，16，8： | 0 |
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