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19篇 您的检索式：作者名="Suhl H"

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		题名	作者	年代	出处	被引量
	1	Thermal kinetics of color degradation of mulberry fruit extract 显示文摘	SUHL H J NOH D O KANG C S	2003	Food/Nahrung2003，47，2：	1
	2	A review of mechanical properties of lead-free solders for electronic packaging显示文摘	MA H T SUHLING J C	2009	Jounal of Materials Science2009，44，：	1
	3	A fast LU update for linear programming显示文摘	SUHL L M SUHL U H	1993	Annals of Operations Research1993，43，：	1
	4	A review of mechanical properties of lead-free soldersfor electronic packaging显示文摘	Ma H T Suhling J C	2009	J Mater Sci2009，44，：	1
	5	A review of mechanical properties of lead-free solders for electronic packaging显示文摘	MA H SUHLING J C	2009	J Mater Sci Mater Electron2009，44，5：	1
	6	A review of mechanical properties of lead-free solders for electronic packaging 显示文摘	MA H SUHLING J C	2009	Journal of Materials Science2009，44，11：	1
	7	Bardeen - Cooper - Schrieffer theory of superconductivity in the case of overlapping bands 显示文摘	Suhl H Matthias B T Walker L R	1959	Physical Review Letters1959，3，12：	1
	8	Characterization of the temperature dependence of thepiezoresistive coefficients of silicon from-150℃to+125℃显示文摘	CHO C H JAEGER R C SUHLING J C	2008	IEEE Sensors2008，8，8：	1
	9	A review of mechanical properties of lead-free solders for electronic packaging显示文摘	MA H T SUHLING J C	2009	Journal of Materials Science2009，44，5：	1
	10	A review of mechanical properties of lead-free solders for electronic packaging 显示文摘	Ma H Suhling J C	2009	Journal of materialsscience2009，44，：	1
	11	Random mutations to evaluate the role of bases at two important single-stranded regions of genomic HDV ribozyme 显示文摘	Kumar P K Suhl Y A Miyashiro H	1992	Nucl Acids Res1992，20，15：	1
	12	Imaging intracellular viscosity of a single cell during photoinduced cell death显示文摘	Kuimova M K Botchway S W Parker A W Balaz M Collins H A Anderson H L Suhling K Ogilby P R	2009	Nature Chemistry2009，1，1：	1
	13	A review of meehanical properties of Jead-free solders for electronic packaging 显示文摘	MA H T SUHLING J C	2009	J Mater Sci2009，44，5：	1
	14	A review of mechanical properties of lead-free solders for electronic packaging显示文摘	Ma H Suhling J C	2009	J Mater Sci2009，44，5：	1
	15	A fast LU update for linear programming显示文摘	SUHL L M SUHL U H	1993	Annals of Operations Research1993，4，3：	1
	16	A review of mechanical properties of lead- free solders for electronic package 显示文摘	Ma H T Suhling J C	2009	Journal of Material Sci- ence2009，44，5：	1
	17	Inhaled colistin following lung transplantation in colonised cystic fibrosis patients显示文摘	Suhling H Rademacher J Greer M		0，，2：	1
	18	查看详情显示文摘	Anderson P W Suhl H		0，，：	1
	19	A review of mechanical properties of lead-free solders for electronic packaging 显示文摘	Ma H Jeffrey C Suhling J C	2009	Journal Materials Science2009，44，5：	1

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